Press releases
OpenLight is at ECOC 2025, Booth #C2322
OpenLight Photonics is exhibiting at ECOC 2025 in Copenhagen, Booth # C2322, 28 September to 1 October 2025.
OpenLight’s silicon photonics, heterogenous integration technology is core to the manufacture of next-generation, semiconductor chips used in datacom, telecom, LiDAR, HPC, AI, and optical computing markets. It improves performance, power, efficiency, and reliability.
OpenLight has made its open-platform PDK available to engineers to design and manufacture bespoke Photonics Application Specific Integrated Circuits (PASIC) for their own industries, extending the global reach and uptake of silicon photonics technology.
OpenLight – making photonics simple.
To arrange a meeting contact: sales@openlightphotonics.com
ECOC 2025 exhibition information can be found here: https://www.ecocexhibition.com...
More Press releases
Silicon Photonics enables fast, energy-efficient data processing.
The EE Times Europe, Q and A interview with Adam Carter, CEO of OpenLight, looks at the company’s vision to bring silicon photonics to the masses.
OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate
New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a…
OpenLight and Tower Semiconductor Demonstrate 400G/lane Modulators Built on Silicon Photonic Wafers for Data Centers and AI Optical Connectivity
Innovation paves the way for a high-volume, silicon photonics 400G/lane platform to meet next-generation 3.2T optical communication architectures…