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Solving the heat problems: How silicon photonics is redefining thermal efficiency in data centers

Read DCD Magazine's industry interview with Adam Carter CEO

OpenLight enters 3.2T era with first volume production orders.

The 'Fibre Systems' article highlights OpenLight’s latest advancements in high-speed PICs for AI applications.

Fabrication of silicon photonics with integrated III–V materials at scale.

Dr. Molly Piels article features in Laser Focus World. 

OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate

New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a…

OpenLight to Showcase Breakthrough III-V Heterogenous Integrated Silicon Photonics Innovations and Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026

OpenLight Introduces 3.2T DR8 Silicon Photonics PICs as well as 1.6T DR8 LRO and LPO Variants

First 3.2T DR8 prototype photonic integrated circuits  ( PICs) have been sampled to multiple transceiver manufacturersFirst orders received for 1.6T…

OpenLight Receives First Volume Production Orders for NewPhotonics® 800G and 1.6T Laser-Integrated PICs with Tower Semiconductor PH18DA InP-on-Silicon Platform

Dr. Steven Alleston discusses ‘Heterogeneous Integration in Silicon Photonics’ at Optica's online meeting.

Join us for the OpenLight sponsored, Optica Online Industry Meeting, where Dr. Steven Alleston, Director of Business Development, and other leading…

OpenLight attending PIC Summit 2026

19 January 2026 - Plug and Play Techology Center, Sunnyvale, California