Press releases
Shaping the future of silicon photonics at OFC.
Thank you to everyone who visited OpenLight at OFC and saw us shaping the future of silicon photonics!
In case you missed our news during the show, here’s a summary of our announcements.
● 400G per lane modulators. Produced by Tower Semiconductor, these are critical building blocks for next-generation, 3.2Tb solutions and beyond.
● 1.6Tb, 200G per lane, DR8 PIC. This is a breakthrough, heterogeneously integrated, silicon photonics solution, comprising 4x DFB lasers; 8x InP-based 224G EAMs; and eight SOAs. OpenLight has made its reference designs available, a new approach in the industry, and has evaluation samples available to test.
● Telcordia GR-468 compliance. Successful completion of Telcordia GR-468 qualification for all active components in its Photonic Design Kit (PDK) based on Tower Semiconductor’s PH18DA process. This confirms suitability for industrial, high-speed, data transfer in cloud computing, AI and ML applications.
● Ecosystem partnerships with TFC and MaxLinear - focused on increased supply chain capability and resilience; faster time-to-market; and lower costs.
OpenLight – making photonics simple.
More Press releases
OpenLight is exhibiting at OFC, BOOTH #4948.
Come and see the world-leader in custom, PASIC chip design and manufacture.
Silicon Photonics Rising to AI Chip Demands
Adam Carter, CEO of OpenLight, a photonics company that has developed an open silicon photonics platform with integrated lasers, recently engaged in…
OpenLight unveils first 800G DR8 photonic integrated circuit design to advance global datacenter interconnect industry
OpenLight speeds creation of 800G DR8 transceivers and accelerates time to market for data center applications.