Press releases
Shaping the future of silicon photonics at OFC.
Thank you to everyone who visited OpenLight at OFC and saw us shaping the future of silicon photonics!
In case you missed our news during the show, here’s a summary of our announcements.
● 400G per lane modulators. Produced by Tower Semiconductor, these are critical building blocks for next-generation, 3.2Tb solutions and beyond.
● 1.6Tb, 200G per lane, DR8 PIC. This is a breakthrough, heterogeneously integrated, silicon photonics solution, comprising 4x DFB lasers; 8x InP-based 224G EAMs; and eight SOAs. OpenLight has made its reference designs available, a new approach in the industry, and has evaluation samples available to test.
● Telcordia GR-468 compliance. Successful completion of Telcordia GR-468 qualification for all active components in its Photonic Design Kit (PDK) based on Tower Semiconductor’s PH18DA process. This confirms suitability for industrial, high-speed, data transfer in cloud computing, AI and ML applications.
● Ecosystem partnerships with TFC and MaxLinear - focused on increased supply chain capability and resilience; faster time-to-market; and lower costs.
OpenLight – making photonics simple.
More Press releases
OpenLight and DoplayDo Expand Silicon Photonics Ecosystem with GDSFactory Support
The collaboration will drive broad adoption and accelerate the integration of silicon photonics chips for datacom, AI, sensing, LiDAR technologies,…
Steve Alleston will present at the EAC2025 Automotive Conference on 4th June.
Steve Alleston of OpenLight is scheduled to present this week at EAC2025, the Enmore Automotive Conference & Exhibition, showcasing innovations…
OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate
New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a…