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Press releases

Shaping the future of silicon photonics at OFC.

Thank you to everyone who visited OpenLight at OFC and saw us shaping the future of silicon photonics! 

In case you missed our news during the show, here’s a summary of our announcements.

● 400G per lane modulators. Produced by Tower Semiconductor, these are critical building blocks for next-generation, 3.2Tb solutions and beyond.

● 1.6Tb, 200G per lane, DR8 PIC. This is a breakthrough, heterogeneously integrated, silicon photonics solution, comprising 4x DFB lasers; 8x InP-based 224G EAMs; and eight SOAs. OpenLight has made its reference designs available, a new approach in the industry, and has evaluation samples available to test.

● Telcordia GR-468 compliance. Successful completion of Telcordia GR-468 qualification for all active components in its Photonic Design Kit (PDK) based on Tower Semiconductor’s PH18DA process. This confirms suitability for industrial, high-speed, data transfer in cloud computing, AI and ML applications.

● Ecosystem partnerships with TFC and MaxLinear - focused on increased supply chain capability and resilience; faster time-to-market; and lower costs.

OpenLight – making photonics simple.

More Press releases

eeNews Europe's interview with Dr Adam Carter at ECOC 2023.
Oct 2023

eeNews Europe's interview with Dr Adam Carter at ECOC 2023.

Nick Flaherty of eeNews Europe interviewed Dr Adam Carter during the European Conference on Optical Communication (#ECOC2023), in Glasgow.

eeNews Europe's interview with Dr Adam Carter at ECOC 2023.
OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025
Nov 2025

OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025

OpenLight’s Dr. Molly Piels joins exclusive cohort of leading experts and will examine recent advances to enable the manufacturing of photonic…

OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025
MaxLinear Unveils RushmoreTM: Low-Power 1.6T PAM4 DSP for AI/ML and Data Center Networks
Apr 2025

MaxLinear Unveils RushmoreTM: Low-Power 1.6T PAM4 DSP for AI/ML and Data Center Networks

Rushmore integrates our latest advancements in DSP technology to address power demands and drive performance in the rapidly expanding AI/ML space.

MaxLinear Unveils RushmoreTM: Low-Power 1.6T PAM4 DSP for AI/ML and Data Center Networks