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Press releases

Shaping the future of silicon photonics at OFC.

Thank you to everyone who visited OpenLight at OFC and saw us shaping the future of silicon photonics! 

In case you missed our news during the show, here’s a summary of our announcements.

● 400G per lane modulators. Produced by Tower Semiconductor, these are critical building blocks for next-generation, 3.2Tb solutions and beyond.

● 1.6Tb, 200G per lane, DR8 PIC. This is a breakthrough, heterogeneously integrated, silicon photonics solution, comprising 4x DFB lasers; 8x InP-based 224G EAMs; and eight SOAs. OpenLight has made its reference designs available, a new approach in the industry, and has evaluation samples available to test.

● Telcordia GR-468 compliance. Successful completion of Telcordia GR-468 qualification for all active components in its Photonic Design Kit (PDK) based on Tower Semiconductor’s PH18DA process. This confirms suitability for industrial, high-speed, data transfer in cloud computing, AI and ML applications.

● Ecosystem partnerships with TFC and MaxLinear - focused on increased supply chain capability and resilience; faster time-to-market; and lower costs.

OpenLight – making photonics simple.

More Press releases

AI/ML and Photonics: A partnership made in heaven?
May 2024

AI/ML and Photonics: A partnership made in heaven?

OpenLight CEO, Dr. Adam Carter, is featured in this month’s Optical Connections magazine, within John Williamson’s article, “AI/ML and Photonics: A…

AI/ML and Photonics: A partnership made in heaven?
OpenLight Sponsors the Tower Semiconductor, Technical Global Symposium TGS 2025
Nov 2025

OpenLight Sponsors the Tower Semiconductor, Technical Global Symposium TGS 2025

TGS 2025 will be held on 18 November in Santa Clara and attended by OpenLight’s leadership and commercial teams.

OpenLight Sponsors the Tower Semiconductor, Technical Global Symposium TGS 2025
OpenLight to Showcase Breakthrough III-V Heterogenous Integrated Silicon Photonics Innovations and Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026
Mar 2026

OpenLight to Showcase Breakthrough III-V Heterogenous Integrated Silicon Photonics Innovations and Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026

OpenLight to Showcase Breakthrough III-V Heterogenous Integrated Silicon Photonics Innovations and Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026