Press releases
Shaping the future of silicon photonics at OFC.
Thank you to everyone who visited OpenLight at OFC and saw us shaping the future of silicon photonics!
In case you missed our news during the show, here’s a summary of our announcements.
● 400G per lane modulators. Produced by Tower Semiconductor, these are critical building blocks for next-generation, 3.2Tb solutions and beyond.
● 1.6Tb, 200G per lane, DR8 PIC. This is a breakthrough, heterogeneously integrated, silicon photonics solution, comprising 4x DFB lasers; 8x InP-based 224G EAMs; and eight SOAs. OpenLight has made its reference designs available, a new approach in the industry, and has evaluation samples available to test.
● Telcordia GR-468 compliance. Successful completion of Telcordia GR-468 qualification for all active components in its Photonic Design Kit (PDK) based on Tower Semiconductor’s PH18DA process. This confirms suitability for industrial, high-speed, data transfer in cloud computing, AI and ML applications.
● Ecosystem partnerships with TFC and MaxLinear - focused on increased supply chain capability and resilience; faster time-to-market; and lower costs.
OpenLight – making photonics simple.
More Press releases
OpenLight will attend the Tower, Technical Global Symposium, 2025.
OpenLight will be attending Tower Semiconductor’s 2025 TGS (Technical Global Symposium) on 16th September 2025, in Shanghai, China.
OpenLight introduces 224G InP-based modulator to advance PIC designs
Datacom customers can now extend their multi-lane DR and FR based datacom designs to 224G per wavelength, doubling overall speed without increasing…
OpenLight unveils first 800G DR8 photonic integrated circuit design to advance global datacenter interconnect industry
OpenLight speeds creation of 800G DR8 transceivers and accelerates time to market for data center applications.