Press releases
Shaping the future of silicon photonics at OFC.
Thank you to everyone who visited OpenLight at OFC and saw us shaping the future of silicon photonics!
In case you missed our news during the show, here’s a summary of our announcements.
● 400G per lane modulators. Produced by Tower Semiconductor, these are critical building blocks for next-generation, 3.2Tb solutions and beyond.
● 1.6Tb, 200G per lane, DR8 PIC. This is a breakthrough, heterogeneously integrated, silicon photonics solution, comprising 4x DFB lasers; 8x InP-based 224G EAMs; and eight SOAs. OpenLight has made its reference designs available, a new approach in the industry, and has evaluation samples available to test.
● Telcordia GR-468 compliance. Successful completion of Telcordia GR-468 qualification for all active components in its Photonic Design Kit (PDK) based on Tower Semiconductor’s PH18DA process. This confirms suitability for industrial, high-speed, data transfer in cloud computing, AI and ML applications.
● Ecosystem partnerships with TFC and MaxLinear - focused on increased supply chain capability and resilience; faster time-to-market; and lower costs.
OpenLight – making photonics simple.
More Press releases
Announcing PDK availability with our unified electronic and photonic design platform
Find out how our process design kit (PDK) streamlines end-to-end design of photonic integrated circuits (PICs) with on-chip laser technology.
Modulation beyond 200G for AI/ML and Ethernet applications.
OpenLight’s Post Deadline Paper Th4C.8 at this year’s OFC, covering Modulation beyond 200G, was an exhibition highlight.
Read Adam Carter's article on 200G per lane integrated photonics technology in PIC Magazine.
Adam Carter, CEO of OpenLight, has his article "200G Plus Per Lane: Powering the Next-Gen Data Deluge" published in this month's PIC magazine, Issue…