Electro Optics: OpenLight showcased 400G-per-lane III-V silicon photonics at OFC 2026
The Electro Optics article, following OFC 2026, covered OpenLight’s demonstration of its heterogeneous III-V silicon photonics devices. It included…
Lightwave: OpenLight pushes photonic integration as AI networks drive optical scaling
The Lightwave article, following OFC 2026, highlights OpenLight’s approach to heterogeneous III–V integration on silicon photonics for…
Solving the heat problems: How silicon photonics is redefining thermal efficiency in data centers
Read DCD Magazine's industry interview with Adam Carter CEO
OpenLight enters 3.2T era with first volume production orders
The 'Fibre Systems' article highlights OpenLight’s latest advancements in high-speed PICs for AI applications.
Fabrication of silicon photonics with integrated III–V materials at scale.
Dr. Molly Piels article features in Laser Focus World.
OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate
New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a…
OpenLight to Showcase Breakthrough III-V Heterogenous Integrated Silicon Photonics Innovations and Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026
OpenLight Introduces 3.2T DR8 Silicon Photonics PICs as well as 1.6T DR8 LRO and LPO Variants
First 3.2T DR8 prototype photonic integrated circuits ( PICs) have been sampled to multiple transceiver manufacturersFirst orders received for 1.6T…
