OpenLight Partners with TFC to Fast-track the Silicon Photonics Back-end Process for Semiconductor Production and Optical Communication Systems

SANTA CLARA, Calif., 31 March 2025 — OpenLight, the world leader in custom PASIC chip design and manufacturing, today announced a new ecosystem partnership with Suzhou TFC Optical Communication Co., Ltd. (TFC), a leading provider of optical sub-assembly integrated solutions and advanced optoelectronic package manufacturing services , aimed at advancing the Silicon Photonics back-end process. This collaboration will streamline the back-end procedure of Wafer processing to FAU (Fiber Array Unit ) subassembly for optical engines, offering a comprehensive solution to optimize the supply chain and enable faster time-to-market at a lower cost amid growing demand in optical interconnects in datacenter AI/ML and LiDAR and sensing markets.

As silicon photonics adoption grows, the entire supply chain must also mature to meet demand, which requires multiple high-volume manufacturing capabilities to be ready for the increasing market need. Currently, a limited number of suppliers can administer the back-end wafer processes to FAU subassembly for optical engines. The ecosystem partnership between OpenLight and TFC will provide an additional one-stop shop to streamline the supply chain and allow customers to scale manufacturing by creating an efficient workflow and simplified process.

As part of the partnership, OpenLight will support TFC’s development of acquiring completed wafers and provide back-end processes, including wafer-level bumping, testing, grinding, and dicing to deliver known-good dies. Customers will have the flexibility to procure the subassemblies directly.

“As part of developing a global ecosystem in packaging silicon photonic integrated circuits including backend semiconductor wafer processing, we are very pleased to have the support along with the technical and manufacturing capabilities of Suzhou TFC Co Ltd to enable our global customers as well as those customers in the chinese markets that we serve” said Dr Adam Carter, CEO at OpenLight. “Bringing TFC’s expertise in high volume manufacturing capability along with their expertise in passive component technologies and solutions into the OpenLight ecosystem will address the backend wafer processing and packaging challenges, break barriers and enable broader industry adoption of heterogeneously integrated silicon photonics”.

“OpenLight plays a key role in boosting customer value through integration that is highly scalable,” said Lucy Ou, Chief Executive Officer at TFC. “We are excited to work closely with OpenLight and support growing market demands of the silicon photonics space. By leveraging our combined expertise and resources, we will enable wide adoption of silicon photonics through enhancing the value of the laser engines for PIC (Photonic Integrated Circuit) and semiconductor OSAT.”