OpenLight announces first process design kit sampler to accelerate component testing

OpenLight industry presentations at ECOC 2024 in Frankfurt / Booth #B130 – Hall 6

OpenLight introduces 224G InP-based modulator to advance PIC designs

Datacom customers can now extend their multi-lane DR and FR based datacom designs to 224G per wavelength, doubling overall speed without increasing…

OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate

New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a…