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Press releases

OpenLight unveils first 800G DR8 photonic integrated circuit design to advance global datacenter interconnect industry

OpenLight speeds creation of 800G DR8 transceivers and accelerates time to market for data center applications.

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Customers design PASICs using OpenLight's Process Design Kit.
Dec 2024

Customers design PASICs using OpenLight's Process Design Kit.

OpenLight is focused on design enablement to provide customers with everything they need to design their own, bespoke PASIC - Photonic…

Customers design PASICs using OpenLight's Process Design Kit.
OpenLight Introduces 3.2T DR8 Silicon Photonics PICs as well as 1.6T  DR8 LRO and LPO Variants
Mar 2026

OpenLight Introduces 3.2T DR8 Silicon Photonics PICs as well as 1.6T DR8 LRO and LPO Variants

First 3.2T DR8 prototype photonic integrated circuits  ( PICs) have been sampled to multiple transceiver manufacturersFirst orders received for 1.6T…

OpenLight Introduces 3.2T DR8 Silicon Photonics PICs as well as 1.6T DR8 LRO and LPO Variants
OpenLight Receives First Volume Production Orders for NewPhotonics® 800G and 1.6T Laser-Integrated PICs with Tower Semiconductor PH18DA InP-on-Silicon Platform
Mar 2026

OpenLight Receives First Volume Production Orders for NewPhotonics® 800G and 1.6T Laser-Integrated PICs with Tower Semiconductor PH18DA InP-on-Silicon Platform

OpenLight Receives First Volume Production Orders for NewPhotonics® 800G and 1.6T Laser-Integrated PICs with Tower Semiconductor PH18DA InP-on-Silicon Platform