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Press releases

OpenLight unveils first 800G DR8 photonic integrated circuit design to advance global datacenter interconnect industry

OpenLight speeds creation of 800G DR8 transceivers and accelerates time to market for data center applications.

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OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate
Mar 2026

OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate

New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a…

OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate
OpenLight announces first process design kit sampler to accelerate component testing
Mar 2023

OpenLight announces first process design kit sampler to accelerate component testing

Now available, the unique PDK sampler offers lab-testing flexibility and enhances PIC design accuracy to accelerate time to market.

OpenLight announces first process design kit sampler to accelerate component testing
OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025
Nov 2025

OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025

OpenLight’s Dr. Molly Piels joins exclusive cohort of leading experts and will examine recent advances to enable the manufacturing of photonic…

OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025