Press releases
OpenLight unveils first 800G DR8 photonic integrated circuit design to advance global datacenter interconnect industry
OpenLight speeds creation of 800G DR8 transceivers and accelerates time to market for data center applications.
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Mar 2026
OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate
OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate
New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a…
Mar 2023
OpenLight announces first process design kit sampler to accelerate component testing
OpenLight announces first process design kit sampler to accelerate component testing
Now available, the unique PDK sampler offers lab-testing flexibility and enhances PIC design accuracy to accelerate time to market.
Nov 2025
OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025
OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025
OpenLight’s Dr. Molly Piels joins exclusive cohort of leading experts and will examine recent advances to enable the manufacturing of photonic…