In the Media
Rob Guzzon of OpenLight presents the 1.6T DR8 PIC and evaluation board
Featuring a Marvell® DSP, in this video from OFC 2026.
Rob’s demonstration showcases a high-speed optical link representative of rack-to-rack data center connectivity in AI clusters. It features flip-chip co-packaging with OpenLight’s 1.6T silicon photonics DR8 PIC, comprising eight 200G lanes and including heterogeneously integrated, 1310 nm DFB lasers, InP-based 224G EAMs, amplifiers, and photo detectors. The Marvell Ara 3 nm 1.6T DSP conditions and processes electrical signals before they are converted to light.
The PIC is designed for use in optical modules or CPO systems to deliver high‑bandwidth optical links, supporting 1.6T today but enabling 3.2T in future.
OpenLight – making photonics simple.
More In the Media
OpenLight enters 3.2T era with first volume production orders
The 'Fibre Systems' article highlights OpenLight’s latest advancements in high-speed PICs for AI applications.
Electro Optics: OpenLight showcased 400G-per-lane III-V silicon photonics at OFC 2026
The Electro Optics article, following OFC 2026, covered OpenLight’s demonstration of its heterogeneous III-V silicon photonics devices. It included…
IEEE Journal: Adam Carter discusses success in 3D PIC design, development, and manufacture
IEEE Journal of Selected Topics in Quantum Electronics. Volume: 32, Issue: 2: 3-D Horizons in Photonics: Integrated Circuits, March-April 2026