OPL OFC 2026 1200

In the Media

Lightwave: OpenLight pushes photonic integration as AI networks drive optical scaling

The Lightwave article, following OFC 2026, highlights OpenLight’s approach to heterogeneous III–V integration on silicon photonics for next-generation AI and high-speed optical interconnects.

The article explains how direct laser integration on photonic chips improves efficiency, power consumption, and thermal performance in high-speed optical systems. It also points to the industry shift from pluggable optics toward co-packaged optics as a way to address bandwidth scaling and electrical interconnect challenges in large AI clusters.

It further emphasizes OpenLight’s PASIC design platform, which enables the development of custom PICs through a PDK and ecosystem-based approach, supporting scalable manufacturing and aligning with fabless semiconductor business models. Beyond datacom, the article notes that photonic integration is expanding into applications such as automotive sensing, industrial systems, defence, medical technologies, and quantum computing.

Read the full article here...

OpenLight – making photonics simple. 

More In the Media

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Dr. Adam Carter is a contributor to the EE Times article, ‘Silicon Photonics Set for Take off’.
Nov 2024

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Electro Optics: OpenLight showcased 400G-per-lane III-V silicon photonics at OFC 2026
Apr 2026

Electro Optics: OpenLight showcased 400G-per-lane III-V silicon photonics at OFC 2026

The Electro Optics article, following OFC 2026, covered OpenLight’s demonstration of its heterogeneous III-V silicon photonics devices. It included…

Electro Optics: OpenLight showcased 400G-per-lane III-V silicon photonics at OFC 2026