In the Media
Lightwave: OpenLight pushes photonic integration as AI networks drive optical scaling
The Lightwave article, following OFC 2026, highlights OpenLight’s approach to heterogeneous III–V integration on silicon photonics for next-generation AI and high-speed optical interconnects.
The article explains how direct laser integration on photonic chips improves efficiency, power consumption, and thermal performance in high-speed optical systems. It also points to the industry shift from pluggable optics toward co-packaged optics as a way to address bandwidth scaling and electrical interconnect challenges in large AI clusters.
It further emphasizes OpenLight’s PASIC design platform, which enables the development of custom PICs through a PDK and ecosystem-based approach, supporting scalable manufacturing and aligning with fabless semiconductor business models. Beyond datacom, the article notes that photonic integration is expanding into applications such as automotive sensing, industrial systems, defence, medical technologies, and quantum computing.
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OpenLight – making photonics simple.
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