In the Media
OpenLight enters 3.2T era with first volume production orders
The 'Fibre Systems' article highlights OpenLight’s latest advancements in high-speed PICs for AI applications.
The Fibre Systems article, “OFC 2026: OpenLight enters 3.2T era with first volume production orders,” highlights OpenLight’s latest advancements in high-speed photonic integrated circuits (PICs) for AI-driven data center applications. It notes that OpenLight has secured its first volume production orders for 800G and 1.6T laser-integrated PICs, signaling a transition from development to commercial deployment.
The article also highlights progress toward 3.2T-class devices, enabled by OpenLight’s heterogeneous integration platform. This approach integrates high-performance optical components on silicon, delivering improved energy efficiency—reported below 0.63 pJ/bit—and supporting the increasing bandwidth demands of next-generation AI infrastructure.
The platform enables scalable, high-volume manufacturing while maintaining performance, with partners such as NewPhotonics among the first to reach volume production.
Overall, OpenLight’s technology is positioned as a key enabler of the industry’s transition to multi-terabit optical interconnects, addressing both power efficiency and scalability challenges as data center networks evolve toward higher speeds and greater integration.
OpenLight – making photonics simple.
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