Press releases
OpenLight 1.6T platform reduces manufacturing costs with a fivefold increase in efficiency
The OpenLight 1.6T PASIC platform has a huge, beneficial impact on the operation and capital equipment costs for silicon photonics, chip manufacturers.
OpenLight uses heterogeneous integration technology to allow multiple, passive and active components to be integrated on to the same, silicon photonics chip. This removes the need to source, package and assemble separate, discrete components to make the chips, hugely reducing the ‘touch time’ of its production and assembly processes.
Manufacturers can benefit from a staggering, fivefold increase in efficiency and capacity from the same machines and assembly lines. This allows them to scale more easily and meet the huge and growing, global demand for 1.6T, optical solutions.
More information about OpenLight’s 1.6T platform: https://openlightphotonics.com...
More Press releases
AI/ML and Photonics: A partnership made in heaven?
OpenLight CEO, Dr. Adam Carter, is featured in this month’s Optical Connections magazine, within John Williamson’s article, “AI/ML and Photonics: A…
OpenLight Partners with TFC to Fast-track the Silicon Photonics Back-end Process for Semiconductor Production and Optical Communication Systems
Partnership provides a solution, combining OSAT (Outsourced Semiconductor Assembly and Test) services with advanced Tx engine designs for optical…
OpenLight and Tower Semiconductor Demonstrate 400G/lane Modulators Built on Silicon Photonic Wafers for Data Centers and AI Optical Connectivity
Innovation paves the way for a high-volume, silicon photonics 400G/lane platform to meet next-generation 3.2T optical communication architectures…