Press releases
OpenLight 1.6T platform reduces manufacturing costs with a fivefold increase in efficiency
The OpenLight 1.6T PASIC platform has a huge, beneficial impact on the operation and capital equipment costs for silicon photonics, chip manufacturers.
OpenLight uses heterogeneous integration technology to allow multiple, passive and active components to be integrated on to the same, silicon photonics chip. This removes the need to source, package and assemble separate, discrete components to make the chips, hugely reducing the ‘touch time’ of its production and assembly processes.
Manufacturers can benefit from a staggering, fivefold increase in efficiency and capacity from the same machines and assembly lines. This allows them to scale more easily and meet the huge and growing, global demand for 1.6T, optical solutions.
More information about OpenLight’s 1.6T platform: https://openlightphotonics.com...
More Press releases
OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate
New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a…
Dr. Steven Alleston discusses ‘Heterogeneous Integration in Silicon Photonics’ at Optica's online meeting.
Join us for the OpenLight sponsored, Optica Online Industry Meeting, where Dr. Steven Alleston, Director of Business Development, and other leading…
OpenLight Raises $34M Series A to Scale Next-Gen Integrated Photonics for AI Data Centers
Series A co-led by Xora Innovation and Capricorn marks OpenLight’s transition from a Synopsys subsidiary to a high-velocity, venture-backed company