Press releases
OpenLight 1.6T platform reduces manufacturing costs with a fivefold increase in efficiency
The OpenLight 1.6T PASIC platform has a huge, beneficial impact on the operation and capital equipment costs for silicon photonics, chip manufacturers.
OpenLight uses heterogeneous integration technology to allow multiple, passive and active components to be integrated on to the same, silicon photonics chip. This removes the need to source, package and assemble separate, discrete components to make the chips, hugely reducing the ‘touch time’ of its production and assembly processes.
Manufacturers can benefit from a staggering, fivefold increase in efficiency and capacity from the same machines and assembly lines. This allows them to scale more easily and meet the huge and growing, global demand for 1.6T, optical solutions.
More information about OpenLight’s 1.6T platform: https://openlightphotonics.com...
More Press releases
OpenLight Partners with Jabil to Address Accelerating Demand for Optical Components in AI, ML, and Datacenter Applications
Industry First “Silicon to Solutions” Manufacturing Approach Paves Way for Scalability of Current and Next Generation Photonic Integrated Circuits…
OpenLight and DoplayDo Expand Silicon Photonics Ecosystem with GDSFactory Support
The collaboration will drive broad adoption and accelerate the integration of silicon photonics chips for datacom, AI, sensing, LiDAR technologies,…
Dr. Adam Carter is a contributor to the EE Times article, ‘Silicon Photonics Set for Take off’.
Adam Carter, CEO of OpenLight, was a contributor to the EE Times article, ‘Silicon Photonics Set for Take off’, by Alan Patterson, published in…