Press releases
OpenLight 1.6T platform reduces manufacturing costs with a fivefold increase in efficiency
The OpenLight 1.6T PASIC platform has a huge, beneficial impact on the operation and capital equipment costs for silicon photonics, chip manufacturers.
OpenLight uses heterogeneous integration technology to allow multiple, passive and active components to be integrated on to the same, silicon photonics chip. This removes the need to source, package and assemble separate, discrete components to make the chips, hugely reducing the ‘touch time’ of its production and assembly processes.
Manufacturers can benefit from a staggering, fivefold increase in efficiency and capacity from the same machines and assembly lines. This allows them to scale more easily and meet the huge and growing, global demand for 1.6T, optical solutions.
More information about OpenLight’s 1.6T platform: https://openlightphotonics.com...
More Press releases
OpenLight attending PIC Summit 2026
19 January 2026 - Plug and Play Techology Center, Sunnyvale, California
OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025
OpenLight’s Dr. Molly Piels joins exclusive cohort of leading experts and will examine recent advances to enable the manufacturing of photonic…
eeNews Europe's interview with Dr Adam Carter at ECOC 2023.
Nick Flaherty of eeNews Europe interviewed Dr Adam Carter during the European Conference on Optical Communication (#ECOC2023), in Glasgow.