Press releases
OpenLight 1.6T platform reduces manufacturing costs with a fivefold increase in efficiency
The OpenLight 1.6T PASIC platform has a huge, beneficial impact on the operation and capital equipment costs for silicon photonics, chip manufacturers.
OpenLight uses heterogeneous integration technology to allow multiple, passive and active components to be integrated on to the same, silicon photonics chip. This removes the need to source, package and assemble separate, discrete components to make the chips, hugely reducing the ‘touch time’ of its production and assembly processes.
Manufacturers can benefit from a staggering, fivefold increase in efficiency and capacity from the same machines and assembly lines. This allows them to scale more easily and meet the huge and growing, global demand for 1.6T, optical solutions.
More information about OpenLight’s 1.6T platform: https://openlightphotonics.com...
More Press releases
OpenLight introduces 224G InP-based modulator to advance PIC designs
Datacom customers can now extend their multi-lane DR and FR based datacom designs to 224G per wavelength, doubling overall speed without increasing…
Announcing PDK availability with our unified electronic and photonic design platform
Find out how our process design kit (PDK) streamlines end-to-end design of photonic integrated circuits (PICs) with on-chip laser technology.
OpenLight Announces Sample Availability of its First 1.6Tb DR8 DFB-based Photonic Integrated Circuit
Technology alleviates system complexity and cost pressures and is capable of handling 1.6Tb data rates at 200G per lane, making it ideal for…