Press releases
OpenLight 1.6T platform reduces manufacturing costs with a fivefold increase in efficiency
The OpenLight 1.6T PASIC platform has a huge, beneficial impact on the operation and capital equipment costs for silicon photonics, chip manufacturers.
OpenLight uses heterogeneous integration technology to allow multiple, passive and active components to be integrated on to the same, silicon photonics chip. This removes the need to source, package and assemble separate, discrete components to make the chips, hugely reducing the ‘touch time’ of its production and assembly processes.
Manufacturers can benefit from a staggering, fivefold increase in efficiency and capacity from the same machines and assembly lines. This allows them to scale more easily and meet the huge and growing, global demand for 1.6T, optical solutions.
More information about OpenLight’s 1.6T platform: https://openlightphotonics.com...
More Press releases
OpenLight and DoplayDo Expand Silicon Photonics Ecosystem with GDSFactory Support
The collaboration will drive broad adoption and accelerate the integration of silicon photonics chips for datacom, AI, sensing, LiDAR technologies,…
Dr. Steven Alleston to speak at the IEEE Photonics Conference (IPC) in Rome, this week.
Dr. Steven Alleston, Senior Director of Business Development at OpenLight, has been invited to speak at the IEEE Photonics Conference (IPC) in Rome,…
Read CEO, Adam Carter's article on AI in CIE magazine
Adam Carter, CEO of OpenLight, has had his article, “AI’s unrelenting power demands drive the need for optics”, published in the June issue of…