Optics

Press releases

OpenLight 1.6T platform reduces manufacturing costs with a fivefold increase in efficiency

The OpenLight 1.6T PASIC platform has a huge, beneficial impact on the operation and capital equipment costs for silicon photonics, chip manufacturers.

OpenLight uses heterogeneous integration technology to allow multiple, passive and active components to be integrated on to the same, silicon photonics chip. This removes the need to source, package and assemble separate, discrete components to make the chips, hugely reducing the ‘touch time’ of its production and assembly processes.

Manufacturers can benefit from a staggering, fivefold increase in efficiency and capacity from the same machines and assembly lines. This allows them to scale more easily and meet the huge and growing, global demand for 1.6T, optical solutions.

More information about OpenLight’s 1.6T platform: https://openlightphotonics.com...

More Press releases

Modulation beyond 200G for AI/ML and Ethernet applications.
Apr 2024

Modulation beyond 200G for AI/ML and Ethernet applications.

OpenLight’s Post Deadline Paper Th4C.8 at this year’s OFC, covering Modulation beyond 200G, was an exhibition highlight.

Modulation beyond 200G for AI/ML and Ethernet applications.
OpenLight attending PIC Summit 2026
Jan 2026

OpenLight attending PIC Summit 2026

19 January 2026 - Plug and Play Techology Center, Sunnyvale, California

OpenLight attending PIC Summit 2026
OpenLight Introduces 3.2T DR8 Silicon Photonics PICs as well as 1.6T  DR8 LRO and LPO Variants
Mar 2026

OpenLight Introduces 3.2T DR8 Silicon Photonics PICs as well as 1.6T DR8 LRO and LPO Variants

First 3.2T DR8 prototype photonic integrated circuits  ( PICs) have been sampled to multiple transceiver manufacturersFirst orders received for 1.6T…

OpenLight Introduces 3.2T DR8 Silicon Photonics PICs as well as 1.6T DR8 LRO and LPO Variants