Press releases
OpenLight 1.6T platform reduces manufacturing costs with a fivefold increase in efficiency
The OpenLight 1.6T PASIC platform has a huge, beneficial impact on the operation and capital equipment costs for silicon photonics, chip manufacturers.
OpenLight uses heterogeneous integration technology to allow multiple, passive and active components to be integrated on to the same, silicon photonics chip. This removes the need to source, package and assemble separate, discrete components to make the chips, hugely reducing the ‘touch time’ of its production and assembly processes.
Manufacturers can benefit from a staggering, fivefold increase in efficiency and capacity from the same machines and assembly lines. This allows them to scale more easily and meet the huge and growing, global demand for 1.6T, optical solutions.
More information about OpenLight’s 1.6T platform: https://openlightphotonics.com...
More Press releases
OpenLight Introduces Fully Integrated 2xFR4 PASIC Samples for Next-Generation Connectivity
Industry-Leading Heterogeneous Integration of Lasers and Electro-absorption Modulators Simplifies Customer Product Development
Come and see OpenLight at OFC, Booth #4231
1 – 3 April, at the Moscone Center, San Francisco.
MaxLinear Unveils RushmoreTM: Low-Power 1.6T PAM4 DSP for AI/ML and Data Center Networks
Rushmore integrates our latest advancements in DSP technology to address power demands and drive performance in the rapidly expanding AI/ML space.