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Press releases

OpenLight offers silicon photonics process design kit

OpenLight’s process design kit (PDK) is now generally available for those interested in designing photonic integrated circuits (PICs) using OpenLight’s technology.

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OpenLight Introduces Fully Integrated 2xFR4 PASIC Samples for Next-Generation Connectivity
Oct 2023

OpenLight Introduces Fully Integrated 2xFR4 PASIC Samples for Next-Generation Connectivity

Industry-Leading Heterogeneous Integration of Lasers and Electro-absorption Modulators Simplifies Customer Product Development

OpenLight Introduces Fully Integrated 2xFR4 PASIC Samples for Next-Generation Connectivity
OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate
Mar 2026

OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate

New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a…

OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate
OpenLight industry presentations at ECOC 2024 in Frankfurt / Booth #B130 – Hall 6
Sep 2024

OpenLight industry presentations at ECOC 2024 in Frankfurt / Booth #B130 – Hall 6

OpenLight industry presentations at ECOC 2024 in Frankfurt / Booth #B130 – Hall 6