The in-depth interview covered four key areas:
- How OpenLight’s heterogenous, integrated silicon photonics technology enables next-generation PASIC designs, which includes all the active elements of silicon photonics, such as lasers, modulators, optical amplifiers, detectors, and photodiodes, onboard.
- The launch of PASIC (Photonic Application Specific Integrated Circuits), where OpenLight enables custom, PASIC chip design and manufacture. OpenLight offers the design enablement, PDK tools, so customers can design and develop their own chips, which OpenLight will guarantee if produced using the PDK. OpenLight also offers inhouse design services for customers and produces silicon photonics chips with foundry partner, Tower Semiconductor.
- The launch of OpenLight’s fully integrated 2xFR4 PASIC building block for 800G and 1.6Tbit/s high-speed, data center interconnects and generative AI applications.
- A look at OpenLight’s prime target markets. High-speed connectivity for Hyperscale and AI; LiDAR, laser sensors for automotive and machine vision; and the emergence of photonic chiplet technology for memory disaggregation.
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