Press releases
OpenLight attending PIC Summit 2026
19 January 2026 - Plug and Play Techology Center, Sunnyvale, California
SANTA CLARA, Calif., January 13th, 2026 — OpenLight’s silicon photonics heterogeneous integration technology is core to the manufacture of next-generation, semiconductor chips used in datacom, telecom, LiDAR, HPC, AI, and optical computing markets. It improves performance, power, efficiency, and reliability.
The company's CEO, Dr Adam Carter, will be in attendance at PIC Summit, an exclusive invitation-only event focusing on the future of photonics and their use in creating faster, more efficient chips for data centers and applications relying on high-speed data transfer. The event takes place on 19 January at Sunnyvale, CA's Plug and Play Tech Center.
OpenLight has made its open-platform PDK available to engineers to design and manufacture bespoke Photonics Application Specific Integrated Circuits (PASIC) for their own industries, extending the global reach and uptake of silicon photonics technology.
OpenLight – making photonics simple.
More Press releases
Dr. Steven Alleston discusses ‘Heterogeneous Integration in Silicon Photonics’ at Optica's online meeting.
Join us for the OpenLight sponsored, Optica Online Industry Meeting, where Dr. Steven Alleston, Director of Business Development, and other leading…
MaxLinear Unveils RushmoreTM: Low-Power 1.6T PAM4 DSP for AI/ML and Data Center Networks
Rushmore integrates our latest advancements in DSP technology to address power demands and drive performance in the rapidly expanding AI/ML space.
OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025
OpenLight’s Dr. Molly Piels joins exclusive cohort of leading experts and will examine recent advances to enable the manufacturing of photonic…