Press releases
OpenLight attending PIC Summit 2026
19 January 2026 - Plug and Play Techology Center, Sunnyvale, California
SANTA CLARA, Calif., January 13th, 2026 — OpenLight’s silicon photonics heterogeneous integration technology is core to the manufacture of next-generation, semiconductor chips used in datacom, telecom, LiDAR, HPC, AI, and optical computing markets. It improves performance, power, efficiency, and reliability.
The company's CEO, Dr Adam Carter, will be in attendance at PIC Summit, an exclusive invitation-only event focusing on the future of photonics and their use in creating faster, more efficient chips for data centers and applications relying on high-speed data transfer. The event takes place on 19 January at Sunnyvale, CA's Plug and Play Tech Center.
OpenLight has made its open-platform PDK available to engineers to design and manufacture bespoke Photonics Application Specific Integrated Circuits (PASIC) for their own industries, extending the global reach and uptake of silicon photonics technology.
OpenLight – making photonics simple.
More Press releases
Announcing PDK availability with our unified electronic and photonic design platform
Find out how our process design kit (PDK) streamlines end-to-end design of photonic integrated circuits (PICs) with on-chip laser technology.
OpenLight Appoints Natalija Filipovic to Accelerate Growth and Photonics Leadership.
Natalija Filipovic joins OpenLight Photonics as Director of Marketing and Sales Operations.
