Press releases
OpenLight attending PIC Summit 2026
19 January 2026 - Plug and Play Techology Center, Sunnyvale, California
SANTA CLARA, Calif., January 13th, 2026 — OpenLight’s silicon photonics heterogeneous integration technology is core to the manufacture of next-generation, semiconductor chips used in datacom, telecom, LiDAR, HPC, AI, and optical computing markets. It improves performance, power, efficiency, and reliability.
The company's CEO, Dr Adam Carter, will be in attendance at PIC Summit, an exclusive invitation-only event focusing on the future of photonics and their use in creating faster, more efficient chips for data centers and applications relying on high-speed data transfer. The event takes place on 19 January at Sunnyvale, CA's Plug and Play Tech Center.
OpenLight has made its open-platform PDK available to engineers to design and manufacture bespoke Photonics Application Specific Integrated Circuits (PASIC) for their own industries, extending the global reach and uptake of silicon photonics technology.
OpenLight – making photonics simple.
More Press releases
OpenLight Partners with VLC Photonics to Expand Design and Test Capacity
Partnership Reduces Time to Market and Accelerates Development of Cutting-Edge PICs
Customers design PASICs using OpenLight's Process Design Kit.
OpenLight is focused on design enablement to provide customers with everything they need to design their own, bespoke PASIC - Photonic…
OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025
OpenLight’s Dr. Molly Piels joins exclusive cohort of leading experts and will examine recent advances to enable the manufacturing of photonic…