Press releases
OpenLight attending PIC Summit 2026
19 January 2026 - Plug and Play Techology Center, Sunnyvale, California
SANTA CLARA, Calif., January 13th, 2026 — OpenLight’s silicon photonics heterogeneous integration technology is core to the manufacture of next-generation, semiconductor chips used in datacom, telecom, LiDAR, HPC, AI, and optical computing markets. It improves performance, power, efficiency, and reliability.
The company's CEO, Dr Adam Carter, will be in attendance at PIC Summit, an exclusive invitation-only event focusing on the future of photonics and their use in creating faster, more efficient chips for data centers and applications relying on high-speed data transfer. The event takes place on 19 January at Sunnyvale, CA's Plug and Play Tech Center.
OpenLight has made its open-platform PDK available to engineers to design and manufacture bespoke Photonics Application Specific Integrated Circuits (PASIC) for their own industries, extending the global reach and uptake of silicon photonics technology.
OpenLight – making photonics simple.
More Press releases
OpenLight Announces Sample Availability of its First 1.6Tb DR8 DFB-based Photonic Integrated Circuit
Technology alleviates system complexity and cost pressures and is capable of handling 1.6Tb data rates at 200G per lane, making it ideal for…
eeNews Europe's interview with Dr Adam Carter at ECOC 2023.
Nick Flaherty of eeNews Europe interviewed Dr Adam Carter during the European Conference on Optical Communication (#ECOC2023), in Glasgow.
OpenLight announces first process design kit sampler to accelerate component testing
Now available, the unique PDK sampler offers lab-testing flexibility and enhances PIC design accuracy to accelerate time to market.