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APPLICATIONS

Telecom

Whilst datacenters have driven available computer power exponentially, there is still a need to connect users via wired or wireless connections and to move data ‘long haul’ between datacenters; often across continents and oceans. High speed access technologies, such as 5G, have driven traffic, especially in the metro network. At the same time, convergence between network layers, including coherent technologies, have enabled a flattening and expansion of metro and regional network domains. Wavelength division Multiplexing (WDM) is a photonic technology that multiplies the capacity of fiber capability and is deployed ever closer to the physical edge of the network.

OpenLight’s technology and design enablement helps customers improve the performance, scalability and ease of manufacture of all the different photonics elements used in telecom devices and systems. It not only brings heterogeneous, laser integration in silicon, but also improvements to the performance, cost and integration of the silicon photonics waveguides, splitters, modulators, gratings and photo detectors that enable telecom systems.

OpenLight’s design enablement brings ease of design and integrated manufacture to the many companies involved in the telecom market, worldwide.

Newsroom

OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate

OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate

New evaluation board for a 400G EAM, based on OpenLight’s heterogeneous integration of InP-on-Si process, is available for testing, and includes a…

OpenLight and TFC Advance Silicon Photonics Back End Integration Supporting up to 400G Data Rates on TGV Substrate
OpenLight to Showcase Breakthrough III-V Heterogenous Integrated Silicon Photonics Innovations and Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026

OpenLight to Showcase Breakthrough III-V Heterogenous Integrated Silicon Photonics Innovations and Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026

OpenLight to Showcase Breakthrough III-V Heterogenous Integrated Silicon Photonics Innovations and Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026
OpenLight Introduces 3.2T DR8 Silicon Photonics PICs as well as 1.6T  DR8 LRO and LPO Variants

OpenLight Introduces 3.2T DR8 Silicon Photonics PICs as well as 1.6T DR8 LRO and LPO Variants

First 3.2T DR8 prototype photonic integrated circuits  ( PICs) have been sampled to multiple transceiver manufacturersFirst orders received for 1.6T…

OpenLight Introduces 3.2T DR8 Silicon Photonics PICs as well as 1.6T DR8 LRO and LPO Variants
OpenLight Receives First Volume Production Orders for NewPhotonics® 800G and 1.6T Laser-Integrated PICs with Tower Semiconductor PH18DA InP-on-Silicon Platform

OpenLight Receives First Volume Production Orders for NewPhotonics® 800G and 1.6T Laser-Integrated PICs with Tower Semiconductor PH18DA InP-on-Silicon Platform

OpenLight Receives First Volume Production Orders for NewPhotonics® 800G and 1.6T Laser-Integrated PICs with Tower Semiconductor PH18DA InP-on-Silicon Platform
Dr. Steven Alleston discusses ‘Heterogeneous Integration in Silicon Photonics’ at Optica's online meeting.

Dr. Steven Alleston discusses ‘Heterogeneous Integration in Silicon Photonics’ at Optica's online meeting.

Join us for the OpenLight sponsored, Optica Online Industry Meeting, where Dr. Steven Alleston, Director of Business Development, and other leading…

Dr. Steven Alleston discusses ‘Heterogeneous Integration in Silicon Photonics’ at Optica's online meeting.
OpenLight attending PIC Summit 2026

OpenLight attending PIC Summit 2026

19 January 2026 - Plug and Play Techology Center, Sunnyvale, California

OpenLight attending PIC Summit 2026
OpenLight Sponsors the Tower Semiconductor, Technical Global Symposium TGS 2025

OpenLight Sponsors the Tower Semiconductor, Technical Global Symposium TGS 2025

TGS 2025 will be held on 18 November in Santa Clara and attended by OpenLight’s leadership and commercial teams.

OpenLight Sponsors the Tower Semiconductor, Technical Global Symposium TGS 2025
OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025

OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025

OpenLight’s Dr. Molly Piels joins exclusive cohort of leading experts and will examine recent advances to enable the manufacturing of photonic…

OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025
OpenLight will attend the Tower, Technical Global Symposium, 2025.

OpenLight will attend the Tower, Technical Global Symposium, 2025.

OpenLight will be attending Tower Semiconductor’s 2025 TGS (Technical Global Symposium) on 16th September 2025, in Shanghai, China.

OpenLight will attend the Tower, Technical Global Symposium, 2025.
Shaping the future of silicon photonics at OFC.

Shaping the future of silicon photonics at OFC.

Thank you to everyone who visited OpenLight at OFC and saw us shaping the future of silicon photonics! 

Shaping the future of silicon photonics at OFC.
Come and see OpenLight at OFC, Booth #4231

Come and see OpenLight at OFC, Booth #4231

1 – 3 April, at the Moscone Center, San Francisco.

Come and see OpenLight at OFC, Booth #4231
OpenLight Achieves Successful Completion of Telcordia GR-468 Qualification for Silicon Photonics Components

OpenLight Achieves Successful Completion of Telcordia GR-468 Qualification for Silicon Photonics Components

Milestone in optoelectronics provides significant assurance in the design and manufacturing process of advanced optoelectronic components, which are…

OpenLight Achieves Successful Completion of Telcordia GR-468 Qualification for Silicon Photonics Components

Information

Technology

Technology

OpenLight’s unique technology enables PASICs to be designed and manufactured with all the passive and active elements onboard. There is no need to…

Technology