Press releases
OpenLight is exhibiting at ECOC 2024 in Frankfurt
Booth #B130 – Hall 6 / 23-25 September.
Learn more about OpenLight’s 1.6Tb PASIC development at ECOC 2024!
OpenLight’s 1.6Tb PASIC platform will enable the design and manufacture of breakthrough, 1.6Tbps, fully integrated optical transmitter interconnect chips for next-generation, hyperscale datacenters. Using OpenLight’s revolutionary, Heterogenous Integration, the InP-based lasers, EAM and all other active components are bonded onto the silicon as part of the integrated photonics chip. This breakthrough brings highly scalable benefits to the datacenter supply chain, as demand for bandwidth increases. These include production efficiency, cost, reliability and capital equipment reductions.
OpenLight’s 1.6Tb platform also benefits AI, High Power Computing (HPC) and machine learning (ML) applications.
Learn more about our 1.6T PASIC platform...
To arrange a meeting contact:
sales@openlightphotonics.com
More Press releases
MaxLinear Unveils RushmoreTM: Low-Power 1.6T PAM4 DSP for AI/ML and Data Center Networks
Rushmore integrates our latest advancements in DSP technology to address power demands and drive performance in the rapidly expanding AI/ML space.
Come and see OpenLight at OFC, Booth #4231
1 – 3 April, at the Moscone Center, San Francisco.
OpenLight Joins Expert Panel Debating Photonics Manufacturing at PECC Summit 2025
OpenLight will present their unique heterogeneous integration technology in a session dedicated to discussing best practices for the production of…