Press releases
OpenLight is exhibiting at ECOC 2024 in Frankfurt
Booth #B130 – Hall 6 / 23-25 September.
Learn more about OpenLight’s 1.6Tb PASIC development at ECOC 2024!
OpenLight’s 1.6Tb PASIC platform will enable the design and manufacture of breakthrough, 1.6Tbps, fully integrated optical transmitter interconnect chips for next-generation, hyperscale datacenters. Using OpenLight’s revolutionary, Heterogenous Integration, the InP-based lasers, EAM and all other active components are bonded onto the silicon as part of the integrated photonics chip. This breakthrough brings highly scalable benefits to the datacenter supply chain, as demand for bandwidth increases. These include production efficiency, cost, reliability and capital equipment reductions.
OpenLight’s 1.6Tb platform also benefits AI, High Power Computing (HPC) and machine learning (ML) applications.
Learn more about our 1.6T PASIC platform...
To arrange a meeting contact:
sales@openlightphotonics.com
More Press releases
OpenLight Announces Sample Availability of its First 1.6Tb DR8 DFB-based Photonic Integrated Circuit
Technology alleviates system complexity and cost pressures and is capable of handling 1.6Tb data rates at 200G per lane, making it ideal for…
OpenLight attending PIC Summit 2026
19 January 2026 - Plug and Play Techology Center, Sunnyvale, California
Dr. Steven Alleston to speak at the IEEE Photonics Conference (IPC) in Rome, this week.
Dr. Steven Alleston, Senior Director of Business Development at OpenLight, has been invited to speak at the IEEE Photonics Conference (IPC) in Rome,…