Press releases
OpenLight is exhibiting at ECOC 2024 in Frankfurt
Booth #B130 – Hall 6 / 23-25 September.
Learn more about OpenLight’s 1.6Tb PASIC development at ECOC 2024!
OpenLight’s 1.6Tb PASIC platform will enable the design and manufacture of breakthrough, 1.6Tbps, fully integrated optical transmitter interconnect chips for next-generation, hyperscale datacenters. Using OpenLight’s revolutionary, Heterogenous Integration, the InP-based lasers, EAM and all other active components are bonded onto the silicon as part of the integrated photonics chip. This breakthrough brings highly scalable benefits to the datacenter supply chain, as demand for bandwidth increases. These include production efficiency, cost, reliability and capital equipment reductions.
OpenLight’s 1.6Tb platform also benefits AI, High Power Computing (HPC) and machine learning (ML) applications.
Learn more about our 1.6T PASIC platform...
To arrange a meeting contact:
sales@openlightphotonics.com
More Press releases
OpenLight introduces 224G InP-based modulator to advance PIC designs
Datacom customers can now extend their multi-lane DR and FR based datacom designs to 224G per wavelength, doubling overall speed without increasing…
OpenLight is exhibiting at OFC, BOOTH #4948.
Come and see the world-leader in custom, PASIC chip design and manufacture.
Silicon Photonics enables fast, energy-efficient data processing.
The EE Times Europe, Q and A interview with Adam Carter, CEO of OpenLight, looks at the company’s vision to bring silicon photonics to the masses.