Press releases
OpenLight is exhibiting at ECOC 2024 in Frankfurt
Booth #B130 – Hall 6 / 23-25 September.
Learn more about OpenLight’s 1.6Tb PASIC development at ECOC 2024!
OpenLight’s 1.6Tb PASIC platform will enable the design and manufacture of breakthrough, 1.6Tbps, fully integrated optical transmitter interconnect chips for next-generation, hyperscale datacenters. Using OpenLight’s revolutionary, Heterogenous Integration, the InP-based lasers, EAM and all other active components are bonded onto the silicon as part of the integrated photonics chip. This breakthrough brings highly scalable benefits to the datacenter supply chain, as demand for bandwidth increases. These include production efficiency, cost, reliability and capital equipment reductions.
OpenLight’s 1.6Tb platform also benefits AI, High Power Computing (HPC) and machine learning (ML) applications.
Learn more about our 1.6T PASIC platform...
To arrange a meeting contact:
sales@openlightphotonics.com
More Press releases
OpenLight Raises $34M Series A to Scale Next-Gen Integrated Photonics for AI Data Centers
Series A co-led by Xora Innovation and Capricorn marks OpenLight’s transition from a Synopsys subsidiary to a high-velocity, venture-backed company
OpenLight to Showcase Breakthrough III-V Heterogenous Integrated Silicon Photonics Innovations and Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026
Come and see OpenLight at OFC, Booth #4231
1 – 3 April, at the Moscone Center, San Francisco.