Press releases
OpenLight is exhibiting at ECOC 2024 in Frankfurt
Booth #B130 – Hall 6 / 23-25 September.
Learn more about OpenLight’s 1.6Tb PASIC development at ECOC 2024!
OpenLight’s 1.6Tb PASIC platform will enable the design and manufacture of breakthrough, 1.6Tbps, fully integrated optical transmitter interconnect chips for next-generation, hyperscale datacenters. Using OpenLight’s revolutionary, Heterogenous Integration, the InP-based lasers, EAM and all other active components are bonded onto the silicon as part of the integrated photonics chip. This breakthrough brings highly scalable benefits to the datacenter supply chain, as demand for bandwidth increases. These include production efficiency, cost, reliability and capital equipment reductions.
OpenLight’s 1.6Tb platform also benefits AI, High Power Computing (HPC) and machine learning (ML) applications.
Learn more about our 1.6T PASIC platform...
To arrange a meeting contact:
sales@openlightphotonics.com
More Press releases
OpenLight Appoints Dr. Adam Carter as Chief Executive Officer
Industry Veteran to Lead Company's Growth with Integrated Laser Open-Foundry Business
OpenLight unveils first 800G DR8 photonic integrated circuit design to advance global datacenter interconnect industry
OpenLight speeds creation of 800G DR8 transceivers and accelerates time to market for data center applications.
OpenLight is at ECOC 2025, Booth #C2322
OpenLight Photonics is exhibiting at ECOC 2025 in Copenhagen, Booth # C2322, 28 September to 1 October 2025.