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Press releases

OpenLight is exhibiting at ECOC 2024 in Frankfurt

Booth #B130 – Hall 6 / 23-25 September.

Learn more about OpenLight’s 1.6Tb PASIC development at ECOC 2024!

OpenLight’s 1.6Tb PASIC platform will enable the design and manufacture of breakthrough, 1.6Tbps, fully integrated optical transmitter interconnect chips for next-generation, hyperscale datacenters. Using OpenLight’s revolutionary, Heterogenous Integration, the InP-based lasers, EAM and all other active components are bonded onto the silicon as part of the integrated photonics chip. This breakthrough brings highly scalable benefits to the datacenter supply chain, as demand for bandwidth increases. These include production efficiency, cost, reliability and capital equipment reductions.

OpenLight’s 1.6Tb platform also benefits AI, High Power Computing (HPC) and machine learning (ML) applications.

Learn more about our 1.6T PASIC platform...

To arrange a meeting contact:

sales@openlightphotonics.com 

ECOC 2024 exhibition information...

More Press releases

OpenLight 1.6T platform reduces manufacturing costs with a fivefold increase in efficiency
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The OpenLight 1.6T PASIC platform has a huge, beneficial impact on the operation and capital equipment costs for silicon photonics, chip…

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OpenLight and their revolutionary approach to photonics
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OpenLight Unveils Brand Identity and Technology Portfolio to Usher in World's First Open Silicon Photonics Platform with Integrated Lasers

Addressing the growing silicon photonics market requirements for improved performance, power efficiency and reliability, OpenLight, a newly launched…

OpenLight Unveils Brand Identity and Technology Portfolio to Usher in World's First Open Silicon Photonics Platform with Integrated Lasers