OpenLight is exhibiting at ECOC 2024 in Frankfurt

Learn more about OpenLight’s 1.6Tb PASIC development at ECOC 2024!

OpenLight’s 1.6Tb PASIC platform will enable the design and manufacture of breakthrough, 1.6Tbps, fully integrated optical transmitter interconnect chips for next-generation, hyperscale datacenters. Using OpenLight’s revolutionary, Heterogenous Integration, the InP-based lasers, EAM and all other active components are bonded onto the silicon as part of the integrated photonics chip. This breakthrough brings highly scalable benefits to the datacenter supply chain, as demand for bandwidth increases. These include production efficiency, cost, reliability and capital equipment reductions.

OpenLight’s 1.6Tb platform also benefits AI, High Power Computing (HPC) and machine learning (ML) applications.

Learn more about our 1.6T PASIC platform...

To arrange a meeting contact:

sales@openlightphotonics.com 

ECOC 2024 exhibition information...