Press releases
OpenLight is exhibiting at ECOC 2024 in Frankfurt
Booth #B130 – Hall 6 / 23-25 September.
Learn more about OpenLight’s 1.6Tb PASIC development at ECOC 2024!
OpenLight’s 1.6Tb PASIC platform will enable the design and manufacture of breakthrough, 1.6Tbps, fully integrated optical transmitter interconnect chips for next-generation, hyperscale datacenters. Using OpenLight’s revolutionary, Heterogenous Integration, the InP-based lasers, EAM and all other active components are bonded onto the silicon as part of the integrated photonics chip. This breakthrough brings highly scalable benefits to the datacenter supply chain, as demand for bandwidth increases. These include production efficiency, cost, reliability and capital equipment reductions.
OpenLight’s 1.6Tb platform also benefits AI, High Power Computing (HPC) and machine learning (ML) applications.
Learn more about our 1.6T PASIC platform...
To arrange a meeting contact:
sales@openlightphotonics.com
More Press releases
How OpenLight and Synopsys are reimagining datacenters through silicon photonics
Steven Alleston, business development director at OpenLight, co-authored this article with Jigesh K. Patel and Keivan Javadi Khasraghi of Synopsys.
OpenLight wishes all its customers a merry Christmas and a happy and prosperous New Year.
We would like to thank all our customers for their valued support during 2024, where we saw record growth. We look forward to an exciting 2025.
What does open PDK really mean?
OpenLight’s open PDK (product development kit) allows customers to design their own, next-generation PASIC, for existing, new and emerging…