Press releases
OpenLight is exhibiting at ECOC 2024 in Frankfurt
Booth #B130 – Hall 6 / 23-25 September.
Learn more about OpenLight’s 1.6Tb PASIC development at ECOC 2024!
OpenLight’s 1.6Tb PASIC platform will enable the design and manufacture of breakthrough, 1.6Tbps, fully integrated optical transmitter interconnect chips for next-generation, hyperscale datacenters. Using OpenLight’s revolutionary, Heterogenous Integration, the InP-based lasers, EAM and all other active components are bonded onto the silicon as part of the integrated photonics chip. This breakthrough brings highly scalable benefits to the datacenter supply chain, as demand for bandwidth increases. These include production efficiency, cost, reliability and capital equipment reductions.
OpenLight’s 1.6Tb platform also benefits AI, High Power Computing (HPC) and machine learning (ML) applications.
Learn more about our 1.6T PASIC platform...
To arrange a meeting contact:
sales@openlightphotonics.com
More Press releases
AI/ML and Photonics: A partnership made in heaven?
OpenLight CEO, Dr. Adam Carter, is featured in this month’s Optical Connections magazine, within John Williamson’s article, “AI/ML and Photonics: A…
eeNews Europe's interview with Dr Adam Carter at ECOC 2023.
Nick Flaherty of eeNews Europe interviewed Dr Adam Carter during the European Conference on Optical Communication (#ECOC2023), in Glasgow.
OpenLight discusses silicon photonics on Embedded Edge podcast
We talk to Adam Carter, CEO of OpenLight, on its open silicon photonics platform with integrated lasers and addressing the challenge of delivering…