Press releases
OpenLight is exhibiting at ECOC 2024 in Frankfurt
Booth #B130 – Hall 6 / 23-25 September.
Learn more about OpenLight’s 1.6Tb PASIC development at ECOC 2024!
OpenLight’s 1.6Tb PASIC platform will enable the design and manufacture of breakthrough, 1.6Tbps, fully integrated optical transmitter interconnect chips for next-generation, hyperscale datacenters. Using OpenLight’s revolutionary, Heterogenous Integration, the InP-based lasers, EAM and all other active components are bonded onto the silicon as part of the integrated photonics chip. This breakthrough brings highly scalable benefits to the datacenter supply chain, as demand for bandwidth increases. These include production efficiency, cost, reliability and capital equipment reductions.
OpenLight’s 1.6Tb platform also benefits AI, High Power Computing (HPC) and machine learning (ML) applications.
Learn more about our 1.6T PASIC platform...
To arrange a meeting contact:
sales@openlightphotonics.com
More Press releases
OpenLight Secures $50 Million in Series A-1 Funding to Accelerate Global Deployment of Next-Generation Photonics
Leading foundry-validated PDK, trusted by more than 25 companies to design and fabricate production-grade PASICs across AI data centers,…
MaxLinear Unveils RushmoreTM: Low-Power 1.6T PAM4 DSP for AI/ML and Data Center Networks
Rushmore integrates our latest advancements in DSP technology to address power demands and drive performance in the rapidly expanding AI/ML space.
Modulation beyond 200G for AI/ML and Ethernet applications.
OpenLight’s Post Deadline Paper Th4C.8 at this year’s OFC, covering Modulation beyond 200G, was an exhibition highlight.