Openlight design enablement

Press releases

Customers design PASICs using OpenLight's Process Design Kit.

OpenLight is focused on design enablement to provide customers with everything they need to design their own, bespoke PASIC - Photonic Application-Specific Integrated Circuit.

OpenLight licenses customers with an open-platform, Process Design Kit (PDK). The PDK takes engineers through all the steps necessary to design a world-leading PASIC. It provides access to a comprehensive library of active photonics components, such as tuneable DFB lasers, EA modulators, optical amplifiers, and photo detectors.

OpenLight’s Heterogeneous Integration technology means that all these active components can be fabricated as part of the same silicon photonics PASIC, removing the need to source and assemble separate lasers on silicon die. In addition, optical performance is improved, due to very low loss between active components and waveguides.

OpenLight – making photonics simple.

Find out more about our design enablement here...

More Press releases

OpenLight Joins Expert Panel Debating Photonics Manufacturing at PECC Summit 2025
Oct 2025

OpenLight Joins Expert Panel Debating Photonics Manufacturing at PECC Summit 2025

OpenLight will present their unique heterogeneous integration technology in a session dedicated to discussing best practices for the production of…

OpenLight Joins Expert Panel Debating Photonics Manufacturing at PECC Summit 2025
“We are now an independent company.”
Jul 2025

“We are now an independent company.”

Stated Adam Carter, CEO, OpenLight, in an interview with embedded.com as its series A investment round completes.

“We are now an independent company.”
OpenLight Introduces Fully Integrated 2xFR4 PASIC Samples for Next-Generation Connectivity
Oct 2023

OpenLight Introduces Fully Integrated 2xFR4 PASIC Samples for Next-Generation Connectivity

Industry-Leading Heterogeneous Integration of Lasers and Electro-absorption Modulators Simplifies Customer Product Development

OpenLight Introduces Fully Integrated 2xFR4 PASIC Samples for Next-Generation Connectivity