Openlight design enablement

Press releases

Customers design PASICs using OpenLight's Process Design Kit.

OpenLight is focused on design enablement to provide customers with everything they need to design their own, bespoke PASIC - Photonic Application-Specific Integrated Circuit.

OpenLight licenses customers with an open-platform, Process Design Kit (PDK). The PDK takes engineers through all the steps necessary to design a world-leading PASIC. It provides access to a comprehensive library of active photonics components, such as tuneable DFB lasers, EA modulators, optical amplifiers, and photo detectors.

OpenLight’s Heterogeneous Integration technology means that all these active components can be fabricated as part of the same silicon photonics PASIC, removing the need to source and assemble separate lasers on silicon die. In addition, optical performance is improved, due to very low loss between active components and waveguides.

OpenLight – making photonics simple.

Find out more about our design enablement here...

More Press releases

OpenLight is exhibiting at ECOC 2024 in Frankfurt
Sep 2024

OpenLight is exhibiting at ECOC 2024 in Frankfurt

Booth #B130 – Hall 6 / 23-25 September.

OpenLight is exhibiting at ECOC 2024 in Frankfurt
OpenLight 1.6T platform reduces manufacturing costs with a fivefold increase in efficiency
Dec 2024

OpenLight 1.6T platform reduces manufacturing costs with a fivefold increase in efficiency

The OpenLight 1.6T PASIC platform has a huge, beneficial impact on the operation and capital equipment costs for silicon photonics, chip…

OpenLight 1.6T platform reduces manufacturing costs with a fivefold increase in efficiency
OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025
Nov 2025

OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025

OpenLight’s Dr. Molly Piels joins exclusive cohort of leading experts and will examine recent advances to enable the manufacturing of photonic…

OpenLight to Present on Heterogeneous Integration of Silicon and III-V Materials for Optical Interconnects and LiDAR at ISPEC 2025